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description the hfbr-779bwz transmitter and hfbr-789bz receiver are high performance fber optic modules for parallel optical data communication applications. these 12- channel devices, operating up to 2.7 gbd per channel, provide a cost efective solution for short-reach appli - cations requiring up to 32 gb/s aggregate bandwidth. these modules are designed to operate on multimode fber systems at a nominal wavelength of 850 nm. they incorporate high performance, highly reliable, short wavelength optical devices coupled with proven circuit technology to provide long life and consistent service. the hfbr-779bwz transmitter module incorporates a 12- channel vcsel (vertical cavity surface emitting laser) array together with a custom 12-channel laser driver integrated circuit providing iec-60825 and cdrh class 1m laser eye safety. the hfbr-789bz receiver module contains a 12-channel pin photodiode array coupled with a custom preampli - fer / post amplifer integrated circuit. operating from a single +3.3 v power supply, both modules provide lvttl or lvcmos control interfaces and current mode logic (cml) compatible data inter - faces to simplify external circuitry. the transmitter and receiver devices are housed in mtp?/ mpo receptacled packages. electrical connections to the devices are achieved by means of a pluggable 10 x 10 connector array. applications ? datacom switch and router backplane connections ? telecom switch and router backplane connections hfbr-779bwz/bewz/bhwz and hfbr-789bz/bez/bhz pluggable parallel fiber optic modules, transmitter and receiver data sheet features ? rohs compliant ? low cost per gb/s ? high package density per gb/s ? 3.3 volt power supply for low power consumption ? 850 nm vcsel array source ? 12 independent channels per module ? separate transmitter and receiver modules ? 2.7 gbd data rate per channel ? standard mtp? (mpo) ribbon fber connector inter - face ? pluggable package ? 62.5/125 micron multimode fber operation: distance up to 100 m with 160 mhz.km fber at 2.5 gbd distance up to 200 m with 400 mhz.km fber at 2.5 gbd ? data i/o is cml compatible ? control i/o is lvttl compatible ? manufactured in an iso 9002 certifed facility ordering information the hfbr-779bwz and hfbr-789bz products are available for production orders through the avago tech - nologies component field sales ofce. hfbr-779bwz no emi nose shield hfbr-789bz no emi nose shield HFBR-779BEWZ with extended emi nose shield hfbr-789bez with extended emi nose shield hfbr-779bhwz no emi nose shield, no heatsink hfbr-789bhz no emi nose shield, no heatsink patent - www.avagotech.com/patents
2 design summary: design for low-cost, high-volume manufacturing avago technologies parallel optics solution combines twelve 2.7 gbd channels into discrete transmitter and receiver modules providing a maximum aggregate data rate of 32 gb/s. moreover, these modules employ a heat sink for thermal management when used on high-density cards, have excellent emi performance, and interface with the industry standard mtp?/mpo connector systems. they provide the most cost-efective high- density (gbd per inch) solutions for high-data capacity applications. see figure 1 for the transmitter and figure 2 for the receiver block diagrams. the hfbr-779bwz transmitter and the hfbr-789bz receiver modules provide very closely spaced, highspeed parallel data channels. within these modules there will be some level of cross talk between channels. the cross talk within the modules will be exhibited as additional data jitter or sensitivity reduction compared to single-channel performance. avago technologies jitter and sensitiv - ity specifcations include cross talk penalties and thus represent real, achievable module performance. functional description, transmitter section the transmitter section, figure 1, uses a 12-channel 850 nm vcsel array as the optical source and a difractive optical lens array to launch the beam of light into the fber. the package and connector system are designed to allow repeatable coupling into standard 12-fber ribbon cable. in addition, this module has been designed to be compliant with iec 60825 class 1 eye safety requirements. the optical output is controlled by a custom ic, which provides proper laser drive parameters and monitors drive current to ensure eye safety. an eeprom and state machine are programmed to provide both ac and dc current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over variations of tem - perature and power supply voltages. functional description, receiver section the receiver section, figure 2, contains a 12-channel algaas/ gaas photodetector array, transimpedence preamplifer, flter, gain stages to amplify and bufer the signal, and a quantizer to shape the signal. the signal detect function is designed to sense the proper optical output signal on each of the 12 channels. if loss of signal is detected on an individual channel, that channel output is squelched. packaging the fexible electronic subassembly was designed to allow high-volume assembly and test of the vcsel, pin photo diode and supporting electronics prior to fnal assembly. regulatory compliance the overall equipment design into which the parallel optics module is mounted will determine the certifca - tion level. the module performance is ofered as a fgure of merit to assist the designer in considering their use in the equipment design. organization recognition see the regulatory compliance table for a listing of the standards, standards associations and testing laboratories applicable to this product. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the frst case is during handling of the module prior to mounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these precautions include using grounded wrist straps, work benches, and foor mats in esd controlled areas. the second case to consider is static discharges to the exterior of the equipment chassis containing the module parts. to the extent that the mtp? (mto) connector recep - tacle is exposed to the outside of the equipment chassis it may be subject to system level esd test criteria that the equipment is intended to meet. see the regulatory compliance table for further details.
3 figure 1. transmitter block diagram. * tx_en, tx_dis, reset-, fault- figure 2. receiver block diagram (each channel). d/ a con ver te r in pu t stag e level sh ifte r dri ver am plifie r com par ator tem per at ure de tectio n ci rcui t d/ a con ver te r controlle r 12 vc sel a rra y di n+ di n- ser ia l contro l i/o * 4 shut do wn 12 12 signal detect circuit limiting amplifier output buffer da ta out da ta out sd trans- imped ance pre- amplifier offset contr ol
4 electromagnetic interference (emi) many equipment designs using these high-data-rate modules will be required to meet the requirements of the fcc in the united states, cenelec in europe and vcci in japan. these modules, with their shielded design, perform to the levels detailed in the regulatory compli - ance table. the performance detailed in the regulatory compliance table is intended to assist the equipment designer in the management of the overall equipment emi performance. however, system margins are dependent on the customer board and chassis design. immunity equipment using these modules will be subject to radio frequency electromagnetic fields in some environ - ments. these modules have good immunity due to their shielded designs. see the regulatory compliance table for further detail. eye safety these 850 nm vcsel-based modules provide eye safety by design. the hfbr-779bwz has been registered with cdrh and certifed by tuv as a class 1m device under amendment 2 of iec 60825-1. see the regulatory com - pliance table for further detail. if class 1m exposure is possible, a safety-warning label should be placed on the product stating the following: laser radiation do not view directly with optical instruments class 1m laser product connector cleaning the optical connector used is the mtp? (mpo). the optical ports have recessed optics that are visible through the nose of the ports. the provided port plug should be installed any time a fber cable is not connected. the port plug ensures the optics remain clean and no cleaning should be necessary. in the event the optics become contaminated, forced nitrogen or clean dry air at less than 20 psi is the recommended cleaning agent. the optical port features, including guide pins, preclude use of any solid instrument. liquids are not advised due to potential damage. process plug each parallel optics module is supplied with an inserted process plug for protection of the optical ports within the mtp? (mto) connector receptacle. handling precautions the hfbr-779bwz and hfbr-789bz can be damaged by current surges and over-voltage conditions. power supply transient precautions should be taken. normal handling precautions for electrostatic sensitive devices should be taken (see esd section). the hfbr-779bwz is a class 1m laser product. do not view radiation directly with optical instru - ments.
5 absolute maximum ratings [1,2] parameter symbol min. max. unit reference storage temperature (non-operating) t s C40 100 c 1 case temperature (operating) t c 90 c 1, 2, 4 supply voltage v cc C0.5 4.6 v 1, 2 data/control signal input voltage v i C0.5 v cc + 0.5 v 1 transmitter diferential data input voltage |v d | 2 v 1, 3 output current (dc) i d 25 ma 1 relative humidity (non-condensing) rh 5 95 % 1 parameter symbol min. typ. max. unit reference case temperature t c 0 40 80 c 2, figs. 3, 4 supply voltage v cc 3.135 3.3 3.465 v figs. 5, 6, 12 signaling rate per channel 1 2.72 gbd 3 data input diferential peak-to-peak voltage swing d v dinp-p 175 1400 mv p-p 4, figs. 7, 8 control input voltage high v ih 2.0 v cc v control input voltage low v il v ee 0.8 v power supply noise for transmitter and receiver n p 200 mv p-p 5, figs. 5, 6 transmitter/receiver data i/o coupling capacitors c ac 0.1 m f fig. 7 receiver diferential data output load r dl 100 w fig. 7 notes: 1. absolute maximum ratings are those values beyond which damage to the device may occur. see reliability data sheet for specifc reliability performance. 2. between absolute maximum ratings and the recommended operating conditions functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. 3. this is the maximum voltage that can be applied across the transmitter diferential data inputs without damaging the input circuit. 4. case temperature is measured as indicated in figure 3. recommended operating conditions [1] notes: 1. recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. see reliability data sheet for specifc reliability performance. 2. case temperature is measured as indicated in figure 3. a 55c, 1 m/s, parallel to the printed circuit board, air fow at the module or equivalent cooling is required. see figure 4. 3. the receiver has a lower cut of frequency near 100 khz. 4. data inputs are cml compatible. coupling capacitors are required to block dc. d v dinp-p = d v dinh C d v dinl , where d v dinh = high state dif - ferential data input voltage and d v dinl = low state diferential data input voltage. 5. power supply noise is defned for the supply, vcc, over the frequency range from 500 hz to 2500 mhz, with the recommended power supply flter in place, at the supply side of the recommended flter. see figures 5 and 6 for recommended power supply flters.
6 electrical characteristics transmitter electrical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference (conditions) supply current i cct 320 415 ma fig. 6 power dissipation p dist 1.1 1.45 w diferential input impedance z in 80 100 120 w 1, fig. 7, 11 fault assert time t off 200 250 s fig. 13 reset assert time t off 5 7.5 s fig. 14 reset de-assert time t on 55 100 ms fig. 14 transmit enable (tx_en) assert time t on 55 100 ms fig. 15 transmit enable (tx_en) de-assert time t off 5 7.5 s 2, fig. 15 transmit disable (tx_dis) assert time t off 5 7.5 s fig. 15 transmit disable (tx_dis) de-assert time t on 55 100 ms fig. 15 power on initiation time t int 60 100 ms fig. 12 control i/os (tx_en, tx_dis fault, reset) lvttl & lvcmos compatible | input current high | |i ih | 0.5 ma (2.0 v < v ih < v cc ) | input current lo w| |i il | 0.5 ma (v ee < v il < 0.8 v) output voltage low v ol v ee 0.4 v (i ol = 4.0 ma) output voltage high v oh 2.5 3.3 v cc v (i oh = C0.5 ma) notes: 1. diferential impedance is measured between d in+ and d inC over the range 4 mhz to 2 ghz. 2. when the control signal transmitter enable, tx_en, is used to disable the transmitter, tx_en must be taken to a logic low-state level (vil) for one millisecond or longer. similarly, if the control signal transmitter disable, tx_dis, is used, then tx_dis must be taken to a logic high- state level (vih) for one millisecond or longer.
7 receiver electrical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference (conditions) supply current i ccr 400 445 ma 1, fig. 5 power dissipation p disr 1.3 1.55 w diferential output impedance z out 80 100 120 w 2, fig. 8, 10 data output diferential peak-to-peak voltage swing d v doutp-p 450 600 750 mv p-p 3, figs. 7, 8 inter-channel skew 100 150 ps 4 diferential data output rise/fall time t r /t f 110 150 ps 5 signal detect assert time (off-to-on) de-assert time (on-to-off) t sda t sdd 170 190 s s 6 7 control i/o lvttl & lvcmos compatible output voltage low output voltage high v ol v oh v ee 2.5 3.1 0.4 v cc v v (i ol = 4.0 ma) (i oh = -0.5 ma) notes: 1. i cc r is the dc supply current, dependent upon the number of active channels, where the data outputs are ac coupled with capacitors between the outputs and any resistive terminations. see figure 7 for recommended termination. 2. measured over the range 4 mhz to 2 ghz. 3. d v doutp-p = d v douth C d v doutl , where d v douth = high state diferential data output voltage and d v doutl = low state diferential data output voltage. d v douth and d v doutl = v dout+ C v doutC , measured with a 100 w diferential load connected with the recommended coupling capacitors and with a 2500 mbd, 8b10b serial encoded data pattern. 4. inter-channel skew is defned for the condition of equal amplitude, zero ps skew input signals. input power at C10 dbm. 5. rise and fall times are measured between the 20% and 80% levels using a 500 mhz square wave signal. 6. the signal detect output will change from logic 0 (low) to 1 (high) within the specifed assert time for a step transition in optical input power from the de-asserted condition to the specifed asserted optical power level on all 12 channels. 7. the signal detect output will change from logic 1 (high) to 0 (low) within the specifed de-assert time for a step transition in optical input power from the specifed asserted optical power level to the de-asserted condition on any 1 channel.
8 optical characteristics transmitter optical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference output optical power 62.5/125 m fiber, na = 0.2 p out C8 C4 C2 dbm avg. 1 output optical power C of state p out dis C30 dbm avg. extinction ratio output power -2 to -8 dbm er 6 7 db 2 center wavelength l c 830 850 860 nm spectral width C rms s 0.4 0.85 nm rms rise/fall time t r /t f 50 100 ps 3 inter-channel skew 110 200 ps 4 relative intensity noise rin C124 db/hz jitter contribution deterministic total dj tj 20 60 60 120 ps p-p ps p-p 5 6 notes: 1. the specifed optical output power, measured at the output of a short test cable, will be compliant with iec 60825-1 amendment 2, class 1 accessible emission limits, ael, and the output power of the module without an attached cable will be compliant with the iec 60825-1 amend - ment 2, class 1m ael. see discussion in the regulatory compliance section. 2. extinction ratio is defned as the ratio of the average output optical power of the transmitter in the high (1) state to the low (0) state and is expressed in decibels (db) by the relationship 10log(phigh avg/plow avg). the transmitter is driven with a 550 mbaud, 2 7 -1 prbs serial encoded pattern. 3. these are unfltered 20-80% value measured with optical-electrical converter with 12 ghz bandwidth. to increase accuracy of measurement owning to laser overshoot and ringing, a fltered rise/fall time measurement is adopted with a 2.5gbps (1.875 ghz bandwidth) 4th bessel thompson flter. a max spec of 100 ps for unfltered waveform is equivalent to a max spec 215 ps for fltered waveform. 4. inter-channel skew is defned for the condition of equal amplitude, zero ps skew input signals. 5. deterministic jitter (dj) is defned as the combination of duty cycle distortion (pulse-width distortion) and data dependent jitter. deterministic jitter is measured at the 50% signal threshold level using a 2.5 gbd pseudo random bit sequence of length 2 23 C 1 (prbs), or equivalent, test pattern with zero skew between the diferential data input signals. 6. total jitter (tj) includes deterministic jitter and random jitter (rj). total jitter is specifed at a ber of 10 -12 for the same 2.5 gbd test pattern as for dj.
9 receiver optical characteristics (t c = 0 c to +80 c, v cc = 3.3 v 5%, typical t c = +40 c, v cc = 3.3 v) parameter symbol min. typ. max. unit reference input optical power sensitivity p in min C18.5 -16 dbm avg. 1 input optical power saturation p in max C2 C1 dbm avg. 2 operating center wavelength l c 830 860 nm stressed receiver sensitivity C15.5 -11.3 dbm 3 stressed receiver eye opening 120 190 ps 4 return loss 12 19 db 5 signal detect asserted de-asserted hysteresis p a p d p a -p d -31 0.5 -19 -21 2 -17 dbm avg. dbm avg. db 6 notes: 1. sensitivity is defned as the average input power with the worst case, minimum, extinction ratio necessary to produce a ber of 10 -12 at the center of the baud interval using a 2.5 gbd pseudo random bit sequence of length 2 23 C 1 (prbs), or equivalent, test pattern. for this parameter, input power is equivalent to that provided by an ideal source, i.e., a source with rin and switching attributes that do not degrade the sensitivity measurement. all channels not under test are operating receiving data with an average input power up to 6 db above p in min . 2. saturation is defned as the average input power that produces at the center of the output swing a receiver output eye width less than 120 ps where ber < 10 -12 using a 2.5 gbd pseudo random bit sequence of length 2 23 C1 (prbs), or equivalent, test pattern. 3. stressed receiver sensitivity is defned as the average input power necessary to produce a ber < 10 -12 at the center of the baud interval using a 2.5 gbd pseudo random bit sequence of length 2 23 C 1 (prbs), or equivalent, test pattern. for this parameter, input power is conditioned with 2.5 db inter-symbol interference, isi, (min), 33 ps duty cycle dependent deterministic jitter, dcd dj (min) and 6 db er (er penalty = 2.23 db). all channels not under test are operating receiving data with an average input power up to 6 db above p in min . 4. stressed receiver eye opening is defned as the receiver output eye width where ber < 10 -12 at the center of the output swing using a 2.5 gbd pseudo random bit sequence of length 2 23 C 1 (prbs), or equivalent, test pattern. for this parameter, input power is an average input optical power of C10.7 dbm and conditioned with 2.5 db isi (min), 33 ps dcd dj (min), 6 db er (er penalty = 2.23 db). all channels not under test are operating receiving data with an average input power up to 6 db above p in min . 5. return loss is defned as the ratio, in db, of the received optical power to the optical power refected back down the fber. 6. signal detect assertion requires all optical inputs to exhibit a minimum 6 db extinction ratio at p a = C17 dbm. all channels not under test are operating with prbs 23 serial encoded patterns, asynchronous with the channel under test, and an average input power up to 6 db higher than p in min.
10 regulatory compliance table feature test method performance electrostatic discharge (esd) to the electrical pads jedec human body model (hbm) (jesd22-a114-b) jedec machine model (mm) transmitter module > 1000 v receiver module > 2000 v transmitter module > 50 v receiver module > 200 v electrostatic discharge (esd) to the connector receptacle variation of iec 61000-4-2 typically withstands at leasr 6 kv air discharge (with module biased) without damage. electromagnetic interference (emi) fcc part 15 cenelec en55022 (cispr 22a) vcci class 1 typically pass with 10 db margin. actual performance dependent on enclosure design. immunity variation of iec 61000-4-3 typically minimal efect from a 10 v/m feld swept from 80 mhz to 1 ghz applied to the module without a chassis enclosure. laser eye safety and equipment type testing iec 60825-1 amendment 2 cfr 21 section 1040 p out : iec ael & us fda crdh class 1m cdrh accession number: 9720151-22 tuv certfcate number: e2171095.04 component recognition underwriters laboratories and canadian standards association joint component rec - ognition for information technology equip - ment including electrical business equipment ul file number: e173874 rohs complaince less than 1000ppm of cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated biphenyl ethers
11 symbol functional description v ee transmitter signal common. all voltages are referenced to this potential unless otherwise indi - cated. directly connect these pads to transmitter signal ground plane. v cc t transmitter power supply. use recommended power supply flter circuit in figure 6. din0+ through din11+ transmitter data in+ for channels 0 through 11, respectively. diferential termination and self bias are included, see figure 11. din0C through din11C transmitter data in- for channels 0 through 11, respectively. diferential termination and self bias are included; see figure 11. tx_en tx enable. active high. internal pull-up high = vcsel array is enabled if tx_dis is inactive (low). low = vcsel array is of. tx_en must be taken to a logic low state level (v ol ) for 1 ms or longer. tx_dis tx disable. active high. internal pull-down low = vcsel array is enabled if tx_en is active (high). high = vcsel array is of. tx_dis must be taken to a logic high state level (v oh ) for 1 ms or longer. reset- transmitter reset- input. active low. internal pull-up. low = resets logic functions, clears fault- signal, vcsel array is of. high = normal operation. see figure 14. fault- transmitter fault- output. active low. low (logic 0) results from a vcsel over-current condi - tion, out of temperature range, or eeprom calibration data corruption condition detected for any vcsel. an asserted (logic 0) fault- disables the vcsel array and is cleared by reset- or power cycling v cc t fault- is a single ended lvttl compatible output. dnc do not connect to any electrical potential. symbol functional description v ee receiver signal common. all voltages are referenced to this potential unless otherwise indicated. directly connect these pads to receiver signal ground plane. v cc r receiver power supply. use recommended power supply flter circuit in figure 5. v pp not required for avago technologies product. pads not internally connected.(voltage for msa compatibility in order to ac-couple receiver data outputs). dout0+ through dout11+ receiver data out+ for channels 0 through 11, respectively. terminate these high-speed diferen - tial cml outputs with standard cml techniques at the inputs of the receiving device. individual data outputs will be squelched for insufcient input signal level. dout0C through dout11C receiver data out- for channel 0 through 11, respectively. terminate these high-speed diferen - tial cml outputs with standard cml techniques at the inputs of the receiving device. individual data outputs will be squelched for insufcient input signal level. sd signal detect. normal optical input levels to all channels results in a logic 1 output, v oh , as - serted. low input optical levels to any channel results in a fault condition indicated by a logic 0 output, v ol , de-asserted. sd is a single-ended lvttl compatible output. rx_en receiver output enable. active high (logic 1), internal pull-up. low (logic 0) = receiver outputs disabled, all outputs are high (logic 1). sq_en squelch enable input. active high (logic 1), internal pull-up. low (logic 0) = squelch disabled. when sq_en is high and sd is low, corresponding outputs are squelched. en_sd enable signal detect. active high (logic 1), internal pull-up. low (logic 0) = signal detect output forced active high. dnc do not connect to any electrical potential. table 2. receiver module pad description table 1. transmitter module pad description
12 dnc j dnc i dnc h v ee g v ee f v ee e v ee d v ee c v ee b dnc a 1 dnc dnc dnc v ee v ee din5+v ee v ee din8+v ee 2 dnc v cct v cct v ee din4+d in5- v ee din7+d in8- v ee 3 dnc v cct v cct din3+d in4- v ee din6+d in7- v ee dnc 4 dnc v cct v cct din3-v ee din2+d in6- v ee din9- v ee 5 dnc v cct v cct v ee din1+d in2- v ee din10- din9+ v ee 6 dnc dnc dnc din0+d in1- v ee din11- din10+ v ee dnc 7 dnc reset- fault- din0-v ee v ee din11+ v ee v ee dnc 8 dnc tx_en tx_dis v ee v ee v ee v ee v ee v ee dnc 9 dnc dnc dnc dnc dnc dnc dnc dnc dnc dnc 10 transmitter module pad assignment (toward mtp? connector) top view (pcb layout) (10 x 10 array)
13 v pp j dnc i dnc h v ee g v ee f v ee e v ee d v ee c v ee b dnc a 1 v pp dnc dnc v ee v ee dout5- v ee v ee dout8- v ee 2 dnc v ccr v ccr v ee dout4- dout5+ v ee dout7- dout8+ v ee 3 dnc v ccr v ccr dout3- dout4+ v ee dout6- dout7+ v ee dnc 4 dnc v ccr v ccr dout3+ v ee dout2- dout6+ v ee dout9+ v ee 5 dnc v ccr v ccr v ee dout1- dout2+ v ee dout10+ dout9- v ee 6 dnc dnc sd dout0- dout1+ v ee dout11+ dout10- v ee dnc 7 v pp dnc dnc dout0+ v ee v ee dout11- v ee v ee dnc 8 v pp rx_en en_sd v ee v ee v ee v ee v ee v ee dnc 9 sq_en dnc dnc dnc dnc dnc dnc dnc dnc dnc 10 receiver module pad assignment (toward mtp? connector) top view (pcb layout) (10 x 10 array)
14 figure 3. case temperature measurement. point for taking module temperature b ar code part n um ber agilent ambient air temperature (?c) 0 30 air speed (m/sec ) 2.0 50 45 0.51 .0 60 2.5 35 40 55 65 80 1.5 heatsink case temp @ 80?c heatsink case temp @ 70?c 70 75 ambient air temperature vs. air spee d w/1.5 watts transmitter worst case figure 4. ambient air temperature and air fow for t c = +80 c and t c = +70 c.
15 figure 5. recommended receiver power supply flter. v cc hfbr-789bz v ccr v ccr v ccr v ccr v ccr v ccr r = 100 0603 c = 10 f 1210 l = 1 h 2220 l = 6.8 nh 0805 r = 1.0 k 0603 c = 0.1 f 0603 c = 0.1 f 0603 c = 10 f 1210 v ccr v ccr note: 1. v cc is defined by 3.135 < v cc < 3.465 vol ts and the power suppl y fil ter has < 50 mv drop across it resul ting in 3.085 < v ccr < 3.415 vol ts. figure 6. recommended transmitter power supply flter. v cc hfbr-779bz r = 100 0603 c = 10 f 1210 l = 1 h 2220 l = 6.8 nh 0805 r = 1.0 k 0603 c = 0.1 f 0603 c = 0.1 f 0603 c = 10 f 1210 note: v cc is defined by 3.135 < v cc < 3.465 volts and the power supply filter has <50 mv drop across it resul ting in 3.085 < v cct < 3.415 volts. v cct v cct v cct v cct v cct v cct v cct v cct
16 figure 7. recommended ac coupling and data signal termination. note: ac coupling capacitors should be used to connect data outputs to data inputs between the hfbr-779b, hfbr-789b, and host board ics (e.g., asic) with either 50 ? single-ended or 100 ? differential terminations as shown. the capacitors' values can be reduced from 100 nf (0603 size) if the data rate and run length are limited. data out (+ ) hfbr-779bz r 50 ? data out (? ) r 50 ? r 100 ? asic hfbr-789bz rdl 100 ? d out (+) d out (?) c = 100 nf c = 100 nf c = 100 nf c = 100 nf unused receiver channel outputs must be terminated. d in+ d in? transmitter ? v din ? + d out+ d out? receiver ? + ? v dout ? v di/oh ? v di/ol v di/o+ v di/o? ? v di/o p-p ? v di/ol ? + ? v di/oh v di/o refers to either v din or v dout as appropriate figure 8. diferential signals.
17 figure 9. package board footprint (dimensions in mm). pcb top view. 2 x ? 2.54 min. p ad keep-out 18.42 min. 13.72 50 keep-out area for mpo connector 5.46 30.23 1.89 ref. 8.00 9 x 1.27 tot = 11.43 8.95 ref. front sym. 9 x 1.27 tot = 11.43 18 ref. sym. end of module 2 x ? 1.7 0.05 holes 3 x ? 4.17 min. p ad keep-out 3 x ? 2.69 0.05 holes for #2 screw (10 x 10 =) 100 x ? 0.58 0.05 p ads pcb layout (top view) 100 pin fci meg-array? plug connect ors rx tx ? 0.1 a b-c ? 0.1 a b-c ? 0.1 a b-c ? 0.1 a b-c b a c ? 0.05 a b-c
18 figure 10. rx data output equivalent circuit. figure 11. tx data input equivalent circuit. v ccr 50 ? 50 ? v ee d out+ d out? d in+ 50 ? d in? 50 ? z in v bias (nominal 1.7 v) v cct v ee v cc tx out 0 tx out 1 tx out 2 tx out 11 ~6.5 ms ~60 ms v cc > 2.8 v shutdown shutdown shutdown shutdown normal normal normal normal ~4.6 ms ~4.6 ms -fault ~100 ns ~toff <200 s tx out ch 0-11 no fault detected fault detected figure 12. typical transmitter power-up sequence. figure 13. transmitter fault signal timing diagram.
19 figure 14. transmitter reset timing diagram. tx out 0 tx out 1 tx out 2 tx out 11 ~4.2 ms (ton) ~55 ms shutdown normal ~4.6 ms ~4.6 ms > 100 ns ~5 s (toff) fault reset tx out ch 0 tx out ch 1 tx out ch 11 ~4.2 ms (ton) ~55 ms ~4.6 ms tx_en ~5 s (toff) shutdown normal tx out ch 0-11 (a) tx_dis ~5 s (toff) shutdown normal tx out ch 0-11 (b) tx_en [1] note [1]: tx_dis, which is not shown, is the functional compliment of tx_en. (c) figure 15. transmitter tx_en and tx_dis timing diagram.
20 module outline figure 16. package outline for hfbr-779bwz and hfbr-789bz (dimensions in mm). (9 x 1.27 =) 11.43 13.72 8.00 5.46 30.23 2x ? 1.1 3 x 2-56 unc x 3.8 mm deep (min.) 1.89 ref. ch 11 ch 0 17.50 14.34 12.90 16.00 ref. 41.07 ref. 8.90 6.95 1.00 17.60 top view front view channel numbers side view back view bottom view transmitter module bottom view receiver module 3 x 2-56 unc x 3.8 mm deep (min.) 30.23 (9 x 1.27 =) 11.43 2x ? 1.1 13.72 notes: 1. module supplied with port process plug. 2. module mass approximately 20 grams. 8.63 optical reference plane bar code part number agilent bar code part number agilent
21 figure 17. package outline for HFBR-779BEWZ and hfbr-789bez (dimensions in mm)
figure 18. host frontplate layout (dimensions in mm) 19.02 mi n 0.50 ma x 13.40 0. 2 3.60 0. 2 15.70 0.25 35.31 0.75 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2013 avago technologies. all rights reserved. av02-1161en - january 29, 2013

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